One of the keys to Apple’s A-series and M-series chips is the system-on-chip (SoC) design, which tightly integrates all parts into a single package. This includes the CPU and GPU.
But a new report suggests that the M5 Pro chip may take a different approach of having more separated CPU and GPU in order to improve performance and boost production yields …
Traditional computers and similar devices had a completely separate CPU (central processing unit) and GPU (graphics processing unit), on completely separate circuit boards.
With the iPhone, Apple incorporated the two into a system known as a System-on-a-Chip (SoC). Essentially, what would have been absolutely separate chips are incorporated into a single, tightly integrated unit that contains circuitry for both. It has replicated this in other devices, adding M-series chips for Apple Silicon Macs.
Whether it’s a single chip or a compact collection of other chips is largely a matter of semantics, but Apple is referring to singular chips, such as in the A18 Pro chip and M4 chip.
Apple analyst Ming-Chi Kuo says that for the M5 Pro chip, Apple will benefit from TSMC’s new chip packaging procedure known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal)Array.
SoIC-mH refers to a method of integrating different chips into a package in a way which improves thermal performance, and therefore allows a chip to run at full power for longer before it needs to be throttled back to reduce heat. It also reportedly boosts production yields, with fewer chips failing to pass quality control.
Kuo’s report indicates that this will be used for the M5 Pro, Max and Ultra variants of the upcoming M5 chip.
The M5 series chips will adopt TSMC’s advanced N3P node, which entered the prototype phase a few months ago. M5, M5 Pro/Max, and M5 Ultra mass production is expected in 1H25, 2H25, and 2026, respectively.
The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.
Interestingly, in the past it was reported that the iPhone 18 would also start separating other elements of the A-series chip, this report refers to the RAM, which has also recently been incorporated into the chip.
Kuo said the M5 Pro chips would be used in Apple Intelligence servers, known as Private Cloud Compute (PCC).
The progression of Apple’s PCC infrastructure will accelerate after the mass production of high-end M5 chips, suitable for AI inference.
Image: Michael Bower/9to5Mac
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Ben Lovejoy is a British and European 9to5Mac generation. He is known for his opinion pieces and periodicals, which explore his experience with Apple products over time, for a more comprehensive critique. He also writes fiction, with two technotriller novels, some science fiction short films and a romantic comedy.