One of the keys to Apple’s A and M series chips is the system-on-a-chip (SoC) design that tightly integrates all parts into a single package. This includes the CPU and GPU.
But a new report suggests that the M5 Pro chip may simply require another additional CPU-GPU separation technique to function and boost production performance. . .
Traditional computers and computer-like devices had completely separate CPU (central processing unit) and GPU (graphical processing unit), often on completely separate circuit boards.
With the iPhone, Apple incorporated the two into a system known as a System-on-a-Chip (SoC). Essentially, what would have been absolutely separate chips are incorporated into a single, tightly integrated unit that contains circuitry for both. It has replicated this in other devices, adding M-series chips for Apple Silicon Macs.
Whether we consider this a single chip or a compact package of different chips is to large degree a matter of semantics, but Apple refers to singular chips – as in the A18 Pro chip, and the M4 chip.
Apple analyst Ming-Chi Kuo says that for the M5 Pro chip, Apple will be taking advantage of TSMC’s very latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).
SoIC-mH refers to an approach of integrating other chips into a package in a way that improves thermal functionality and allows a chip to run at full strength for longer before having to slow it down to reduce heat. It would also increase production performance. with fewer chips that fail quality control.
Kuo’s report states that this will be used for the M5 Pro, Max, and Ultra variants of the upcoming M5 chip.
The M5 series chips will adopt TSMC’s complex N3P node, which entered the prototype level a few months ago. Mass production of the M5, M5 Pro/Max and M5 Ultra is expected to take place in 1H25, 2H25 and 2026 respectively.
The M5 Pro, Max and Ultra will use a server-grade SoIC case. Apple will use a 2. 5D package called SoIC-mH (horizontal molding) to produce performance and thermal performance, with separate CPU and GPU designs.
Interestingly, it was reported in the past that the iPhone 18 would also begin separating other elements of the A-series chip, that report highlights RAM, which has also been added to the chip lately.
Kuo said the M5 Pro chips would be used in Apple Intelligence servers, known as Private Cloud Compute (PCC).
The progression of Apple’s PCC infrastructure will accelerate after the mass production of high-end M5 chips, which are suitable for AI inference.
Image: Michael Bower/9to5Mac
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Ben Lovejoy is a British technology writer and EU Editor for 9to5Mac. He’s known for his op-eds and diary pieces, exploring his experience of Apple products over time, for a more rounded review. He also writes fiction, with two technothriller novels, a couple of SF shorts and a rom-com!