One of the keys to Apple’s A and M series chips is the system-on-a-chip (SoC) design that tightly integrates all parts into a single package. This includes the CPU and GPU.
But a new report suggests that the M5 Pro chip may simply require another additional CPU-GPU separation technique to function and boost production performance. . .
Traditional computers and similar devices had an absolutely separate CPU (central processing unit) and a GPU (graphics processing unit), on absolutely separate circuit boards.
With the iPhone, Apple incorporated the two into a system known as a System-on-a-Chip (SoC). Essentially, what would have been absolutely separate chips are incorporated into a single, tightly integrated unit that contains circuitry for both. It has replicated this in other devices, adding M-series chips for Apple Silicon Macs.
Whether this is a single chip or a compact package of other chips is largely a matter of semantics, but Apple is referring to single chips, such as the A18 Pro chip and the M4 chip.
Apple analyst Ming-Chi Kuo says that for the M5 Pro chip, Apple will benefit from TSMC’s new chip packaging procedure known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal)Array.
SoIC-mH refers to an approach of integrating other chips into a package in a way that improves thermal functionality and allows a chip to run at full strength for longer before having to slow it down to reduce heat. It would also increase production yield. with fewer chips failing quality control.
Kuo’s report claims that this will be used for the M5 Pro, Max and Ultra variants of the upcoming M5 chip.
The M5-series chips will adopt TSMC’s complex N3P node, which entered the prototype level a few months ago. Mass production of the M5, M5 Pro/Max and M5 Ultra is expected to take place in 1H25, 2H25 and 2026 respectively.
The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.
Interestingly, in the past it was reported that the iPhone 18 would also start separating other elements of the A-series chip, that report highlights the RAM, which has also been incorporated lately into the chip.
Kuo also indicated that M5 Pro chips would be used in Apple Intelligence servers, known as Private Cloud Compute (PCC).
The progression of Apple’s PCC infrastructure will accelerate after the mass production of high-end M5 chips, which are suitable for AI inference.
Image: Michael Bower/9to5Mac
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Ben Lovejoy is a British and European editor at 9to5Mac. He is known for his opinion pieces and magazine articles, exploring his experience with Apple products over time for a more comprehensive review. He also writes fiction, with two techno-thriller novels, some science fiction short films and a romantic comedy.