One of the keys to Apple’s A and M series chips is the system-on-chip (SoC) design that tightly integrates all parts into a single package. This includes the CPU and GPU.
But a new report suggests that the M5 Pro chip may simply require another additional CPU and GPU separation technique to function and increase production performance. . .
Traditional computers and similar devices had an absolutely separate CPU (central processing unit) and a GPU (graphics processing unit), on absolutely separate circuit boards.
With the iPhone, Apple incorporated the two into a system known as a System-on-a-Chip (SoC). Essentially, what would have been absolutely separate chips are incorporated into a single, tightly integrated unit that contains circuitry for both. It has replicated this in other devices, adding M-series chips for Apple Silicon Macs.
Whether this is a single chip or a compact collection of other chips is largely a matter of semantics, however, Apple is referring to singular chips, such as the A18 Pro chip and the M4 chip.
Apple analyst Ming-Chi Kuo claims that for the M5 Pro chip, Apple will take merit of TSMC’s newest chip packaging procedure known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal)Array
SoIC-mH refers to a method of integrating different chips into a package in a way which improves thermal performance, and therefore allows a chip to run at full power for longer before it needs to be throttled back to reduce heat. It also reportedly boosts production yields, with fewer chips failing to pass quality control.
Kuo’s report indicates that this will be used for the M5 Pro, Max and Ultra variants of the upcoming M5 chip.
The M5-series chips will adopt TSMC’s complex N3P node, which entered the prototype a few months ago. Mass production of the M5, M5 Pro/Max and M5 Ultra is expected in 1H25, 2H25 and 2026 respectively.
The M5 Pro, Max, and Ultra will use a server-grade SoIC enclosure. Apple will use a 2. 5D package called SoIC-mH (horizontal molding) to produce yields and thermal performance, with separate CPU and GPU designs.
Interestingly, it was reported in the past that the iPhone 18 would also begin separating other elements of the A-series chip, that report highlights RAM, which has also been added to the chip lately.
Kuo said the M5 Pro chips would be used in Apple Intelligence servers, known as Private Cloud Compute (PCC).
Apple’s PCC infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.
Image: Michael Bower/9to5Mac
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Ben Lovejoy is a British and European 9to5Mac generation. He is known for his opinion pieces and periodicals, which explore his experience with Apple products over time, for a more comprehensive critique. He also writes fiction, with two technotriller novels, some science fiction short films and a romantic comedy.