With the i.MX 8 series, NXP has brought a new circle of familiar application processors that provide ultra-broad scalability based on the Arm Cortex-A53 and A35 core architectures. To date, the family circle of processors has six members, ranging from high-performance i.MX versions i.MX to i.MX 8X variants of optimized cost. Recently, they have to be taken in several SMARC and Qseven modules in a number of variants (Fig. 1). They are based on i.MX 8 processors, i.MX 8X processors, and the new 8M Mini i.MX processors, which in particular target integrated applications.
1. SMARC and Qseven compute modules provide NXP i.MX8-based programs with an application-ready ecosystem that accelerates marketing and reduces NRE costs, while ensuring over scalability and long-term availability.
Arm Ecosystem flagship processors
The ARMv8-A-based 64-bit ARM Cortex-A53 architecture, which offers up to 60% more functionality than its predecessor Cortex-A7, leads all variants of NXP i.MX 8 with the 8X suffix. It also provides advanced power control for minimal heat generation and maximum battery life in cellular applications.
The main X variant is the Cortex-A35 architecture, which provides up to 40% more functionality than Cortex-7-based systems. Even when compared to the A53’s options, the architecture of the A35 offers a small space and a reduced price. For memory-intensive workloads, computational functionality is comparable; even for full workloads, 84-85% functionality is achieved. These and others make the A53 and A35 cores lately the most exciting application processors in the Arm ecosystem.
Basic complexes in configurations
As a result, NXP has made hearts available in many chip variants i.MX 8 with different so-called ‘heart complexes’. Depending on the application box, more cores are added, such as the high-function A72, which has a messy functionality unlike the A53. As a result, the A72 reaches 6.35 DMIPS/MHz, or nearly 3 times the computation force consistent with the A53 megahertz with 2.24 DMIPS/MHz. Virtualized hardware platforms are the most productive candidates to harness this strength.
Other spaces in which other series and processor variants differ come with integrated graphics units, the number of built-in M4F microlers for I/O functions, and signaling and processing. M4F also supports formula tracking when Cortex-A cores are turned off to save power. The maximum fundamental complexities for embedded computing programs are necessarily variants i.MX 8 without suffix, as well as those with the suffixes 8M Mini and 8X, where functionality is getting lower.
High-end with 4K graphics
SMARC and Qseven modules with i.MX 8 are on 8QuadMax, 8QuadPlus and 8DualMax i.MX processors. Along with 4 A53 cores, the QuadMax also features two high-performance Arm Cortex-A72 cores; 8QuadPlus has an A72. The processor i.MX 8DualMax, on the other hand, absolutely dispenses with A53 cores in exchange for two A72 cores.
With two sets of GC7000 graphics (1x for i. MX 8 DualMax), they will offer complex graphical functions for up to 3 independent 1080p displays or a single 4K monitor. SMARC and Qseven Computer-on-Modules (COM) in position to offer HDMI 2.0 in one position for the application with HDCP 2.2, 2x LVDS and 1x eDP 1.4. Support is also provided for the Vulkan interface, as well as for openCL, OpenGL and OpenVX; the latter is especially suitable for real-time use on board. Apps include face tracking, frames and gestures, intelligent video surveillance, advanced driving assistance systems (ADAS), object and scene reconstruction, augmented reality, visual or robotic inspection.
Many other features make those SSBs incredibly resilient and flexible. The list includes 2xGbE with optional for IEEE1588 Precision Time protocol, Up to 6x USB adding 1x USB 3.1, up to 2x PCIe Gen 3.0, 1x SATA 3.0, 2x CAN bus, 4x UART, as well as Wi-Fi/Bluetooth module with Wi-Fi 802.11 b/g/ny BLE as well as two MIPI-2 video inputs.
Low-end for cost-sensitive applications
With its Arm Cortex-A35, SMARC and Qseven COM cores with the NXP i.MX 8X variants based on Cortex-A35 are power and load saving champions. They are reduced to a GC7000 graphics unit with or without video acceleration and an MfourF I/O controller. However, they will offer a set of exceptional features in the built-in computing elegance of 2 to four W for two screens through 1x LVDS dual channel, 2x MIPI-DSI or HDMI 1.3. For the other I/O, there are only two differences: modules with 8X i.MX will offer one instead of two PCIe Gen 3.0 lanes, and one instead of two MIPI-CSI camera inputs.
Otherwise, all features that add Ethernet in IEEE 1588 in real time are largely comparable. The spectrum of uses i.MX 8X, therefore, ranges from IoT-connected devices in external and cellular vehicle applications, to commercial IIoT and Industry 4.0 devices and systems with hardware virtualization.
Industrial and IoT for universal use
In the midrange, 8M Mini variants will offer a low-power A53 core design with a 14nm FinFet microarchitecture, other high-end processors with no suffix. Thanks to the more effective 14nm structure, they have a maximum clock frequency of 1.8 GHz for superior functionality with optimized power consumption.
According to NXP, i.MX’s 8M mini circle of family members, widely scalable, with single, dual-core, quad-core processors, can be universally used in all commercial and IoT programs where all the features of the least complex variants of i. MX 8M Nano falls short. The main benefits of the i.MX8 M Mini come with generic PCIeArray which in SMARC COM is used for the popular feature set of this specification along with video encoding and interpretation functions.
From high-end low-power systems with high-resolution 3D graphics to broadly scalable mid-range systems and ultra-energy-efficient 2-W systems, the NXP i.MX 8 family offers countless possibilities supported by application-ready COM ecosystems.
Achieving goals faster, less expensive and more sustainably
Module-based computer criteria, such as SMARC and Qseven, act as a type of binding logic between the application and the actual hardware components. OEMs also get advantages from software compatibility that goes beyond individual processor families.
Since APIs are identical for different processor generations and manufacturers, specific hardware interfaces can be handled in a uniform way. This accelerates time-to-market, simplifies OEM documentation, and ensures sustainable scalability to support the next product, regardless of the processor manufacturer. In short, they are ideal conditions to test the universal applicability of the i.MX8 portfolio.
Evaluation platforms with a set of features
Evaluation carrier boards are widely available for this purpose (Fig. 2). Supporting the entire feature set of potential options for each of the standards, they’re provided as application-ready starter kits that include everything needed. Carrier-board solutions based on recognized embedded motherboard and single-board computer standards are becoming increasingly attractive as well. They also meet all requirements for field deployment, as they can be easily fitted within the appropriate housing and then certified as systems.
2. The evaluation card includes a full set of features designed to make it less difficult for developers to check new processors and applications.
Based on 3.5-inch SMARC. Boards
An example is 3.5 inches. (146-102 mm) conga-SMC1 (Fig.3). It includes interfaces explained through SMARC 2.1, adding for dualgbE, USB and USB hub, SATA 3 for external hard drives or SSDs, and UART sound, 2x CAN, 8x GPIO, I2C, SPI and I2S.
3. Carrier boards like the 3.5-in. conga-SMC1 board can be scaled with i.MX8 SMARC modules. Such flexibility is an important factor whether designing product families or small batch sizes. At congatec, customers can also request the schematics to create their own layouts.
For express extensions, the card offers a mini-pce slot as well as an M.2 Type E2230 slot with I2S, PCIe and USB, and an M.2 Type B2242/2280 slot with 2x PCIe and 1x USB. A built-in MicroSim slot is also provided for IoT connection. The displays can be connected HDMI, LVDS/eDP/DP and MIPI-DSI. The card also offers two MIPI-CSI inputs for camera connection, which are also part of the popular one. The new popular SMARC 2.1 even adds two other MIPI CSI ports that are backward compatible with SMARC 2.0.
These cards can be delivered incredibly flexibly with one of the future modules based on i.MX 8. Variants that do not require all interfaces can be produced in relatively small quantities using the same circuit boards, but with a thinner nomenclature (BOM). The capacity is limited to the precise diversity of the respective module, allowing you to provide commercial quality batches at any time.
Easy integration
Carrier cards that already have two MIPI-CSI inputs with flat-sheet connectors are especially advantageous, meaning you can incorporate any MIPI camera and no more hardware.
The strength of Arm-based vision platforms has already been demonstrated through a ready-to-use retail kit from congatec, Basler, and NXP, which uses synthetic intelligence to recognize products without the need for barcodes or QR. The elements are detected in real time by streaming video provided via the built-in camera in com i.MX 8 used on the site. The formula is so resilient that it doesn’t require a cloud connection, unlike all existing voice assistants, who still want a permanent connection for speech recognition.
Integrating the wireless solution
Many programs other than synthetic intelligence and complex vision also require wireless connectivity. This can be incorporated into some SMARC modules or on the carrier card. However, a popular edition is designed to meet the maximum requirements.
In most cases, OEMs will only require a very specific feature set that’s as cost-and energy-efficient as possible. To achieve this, embedded vendors like congatec also help customers find and integrate the right wireless solution for the specific application in terms of throughput, functionality, cost, and compatibility.
Covering security issues
Security is just another increasingly important issue: The data and functional security of i.MX 8-based devices is best ensured via High Assurance Boot (HAB). HAB allows only authenticated software to be executed on the ARM device. Not only is this important for IoT-connected devices, but also particularly for all security-critical applications in the healthcare and eGovernment sector, where sensitive personal data needs protecting at all costs. As BSI certification is often required for such use cases, OEMs should look for vendors who provide its customers with appropriate firmware and software support in addition to extensive documentation.
Bootable on the shelf
To start their ratings directly, Arm developers also want a completeArray software, such as card packages with a well-configured get get start loader, well-compiled Linux, Yocto and Android images, and all mandatory drivers. The precompiled binaries provided through congatec on GitHub incorporate all those components. By using Arm-based modules, developers can start working as easily as they would in the Windows world.
Immediately in an integration position
With the new SMARC and Qseven modules based on i.MX 8, developers of built-in IIoT programs and vision can succeed at the next generation point temporarily and easily. In fact, they can seamlessly integrate a popular credit card length module into their programs and with minimal space. Ready-to-use starter kits and cards, such as 3.5-inch. Congatec CBS is a component of the entire product and i.MX 8 ecosystem. With low NRE costs, they help drive the assessment and market arrival of this all-new processor architecture, which will open up many new application spaces, such as real-time commercial programs and vision-based artificial intelligence.
Deep Learning Starter Kit for Retail Apps
Basler, Congatec and NXP have jointly developed a deep learning starter kit based on a MIPI-CSI 2 (Fig.4) camera for the retail sector. It illustrates the diversity of probabilities vision technologies bring to integrated programs and how they can simplify our lives.
4. The deep learning camera-based starter kit targets the retail industry.
Formed with a neural network and facial recognition, the formula recognizes parts in a shopping cart based on a video stream to calculate and demonstrate the final bill. These formulas open new perspectives for retail applications: they make it very easy to upload products to the diversity of products on offer, as they can be incorporated with neural network education or even parsimonious modeling.
Retailers gain advantages from reduced labor prices and improved grocery buying with instant money records, shorter queues, and a 100 percent pay capacity at any time, even when the store is open 24/7. The formula is based on a Basler integrated vision kit with an NXP i.MX 8QuadMax SoC running on conga-SMX8 SMARC 2.0 COM congatec, a SMARC 2.0 carrier card and Basler’s Dart BCON camera module for MIPI thirteen MP.
Dan Demers is Director of Sales and Marketing at congatec Americas.
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A webinar on Electronic Design on August 19 and sponsored through ProPlus
Date: Wednesday, August 19, 2020 Time: 11:00 a.m., Eastern Sponsor Summer Time: ProPlus Electronics Co., Ltd. Duration: 30 minutes
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This webinar describes the industry’s first parametric verification solution that offers low frequency NOISE measurement IV (current-voltage), CV (capacity-voltage) and 1/f five times faster than the competitor’s Keys/Agilent and Tektronix/Keithley offers with the same maximum accuracy. The solution offers wide diversity and maximum accuracy measurement: sensitivity up to 200 V, 1 A (3 A pulsed) and 0.1 fA, second floor noise 28A2 / Hz, lowest frequency at 0.001 Hz. The modular architecture of the solution for flexible check configurations and is expandable for traditional wafer acceptance checks (WAT). The presentation will detail the programs of this solution in the characterization of low frequency noise for complex studies and demonstrate its merit against competitive offers.
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Yanfeng Li, Executive Vice President, ProPlus Electronics Co., Ltd.
Mr. Yanfeng Li is recently executive vice president of ProPlus Electronics Co., Ltd. Mr. Li is an experienced EDA expert with 20 years of experience in product progression and business management. Mr. Li graduated from Tsinghua University and Vanderbilt University in Electrical Engineering and more than 15 technical articles, adding a DATE Best Paper. Prior to joining Proplus, he was the founder and CEO of Platform Design Automation (acquired through Proplus in 2019) and served as CEO of Accelicon (acquired through Agilent in 2012), he also held studies and progression positions at Cadence and PDF Solutions.
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